Expertise
What we do, and where we go deep.
Seven capabilities that cover the path from idea to shipped unit, and four domains where we know the failure modes. Open any row for the detail.
Capabilities
The whole path, from idea to shipped unit.
Electronics & PCB design
Schematic to layout to bring-up.
- Multi-layer layout, controlled impedance where it matters
- Power trees, battery management and charging
- Sensor front-ends and mixed-signal design
- DFM and DFA review with your fab and assembler
- Bring-up, debug and revision planning
Firmware & embedded
Drivers, wireless, low power, over-the-air updates.
- STM32, ESP32, nRF, RP2040 and Linux-class SoCs
- BLE, Wi-Fi, LoRa and cellular integration
- Secure boot, OTA and device provisioning
- Power budgeting and sleep-state design
- Hardware-in-the-loop test setups
Software & tooling
Companion apps, dashboards, test automation.
- Web and desktop tools for configuration and diagnostics
- Telemetry pipelines and dashboards
- Production test software and reporting
- CI for firmware and hardware artefacts
Mechanical & thermal
Enclosures, seals, heat paths, DFM.
- Enclosure design from concept to production drawings
- Thermal analysis and heat-path design
- Ingress protection, gaskets and sealing
- Tolerance stacks and fit checks
- DFM for machining, sheet metal and moulding
Prototyping & small batches
First article to pilot run.
- Quick-turn PCBs, printed and machined parts
- Pilot runs of tens to hundreds of units
- Supplier sourcing and quoting
- Work instructions and assembly documentation
- BOM management and part-number control
Test, QC & reliability
Jigs, inspection criteria, failure analysis.
- Functional test jigs and fixtures
- Inspection criteria and acceptance sampling
- Burn-in, environmental and drop testing
- Failure analysis and corrective actions
- Traceability, serialisation and records
Product discovery & identity
Requirements, sprints, a name and a logo.
- Customer interviews and requirement synthesis
- Design-thinking workshops and sprints
- Concept selection with clear trade-offs
- Naming, logo and a lightweight identity system
Domains
Four domains we know from the inside.
UAV & robotics
From a fuzzy problem to a written problem statement, an architecture and a test plan.
- Problem statements and feasibility studies
- Payload integration: sensors, gimbals, compute
- Flight electronics, power and telemetry
- Ground stations and data handling
- Test plans that keep you safe and compliant
Handheld & embedded devices
Battery, screen, radio, real thermal limits. Our own Lab hardware lives here.
- Compact multi-board designs
- Display, input and audio integration
- Battery life that matches the spec sheet
- Enclosures that feel finished
IoT & sensing
Nodes, gateways, data pipelines, and the fleet plumbing that makes a deployment stick.
- Low-power sensor nodes and gateways
- MQTT, time-series storage and dashboards
- Calibration and data quality
- Fleet provisioning and updates
Industrial tools & test equipment
Fixtures, instruments and automation built to survive a workshop.
- Test fixtures and measurement rigs
- Data loggers and instrument control
- Machine retrofits and interfaces
- Documentation your technicians will read
UAV problem statements
Bring us a fuzzy problem. Leave with a plan.
Most UAV projects fail before the first flight because the problem was never written down. We start there.
- 01
Frame
What must it do, where, for how long, carrying what? We write the problem statement with you.
- 02
Explore
Two or three candidate architectures with honest trade-offs.
- 03
De-risk
The riskiest assumption gets tested before anything is bought. Regulatory constraints checked here, not at the end.
- 04
Plan
A build and test plan with cost, schedule and go/no-go points.
Usually two to four weeks, run as a project.
Not sure which capability you need?
Describe the problem, not the solution. Working out which disciplines it touches is part of the job.